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    Perbandingan Honor Pad X9 dan realme Pad X

    Price: Dari RM779   1099 Dari RM999   1699
    Dilancarkan
    Release Status Release 2023, Jul 20 Release 2022, May 26
    Prestasi
    CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (2x2.2 GHz Kryo 660 Gold & 6x1.7 GHz Kryo 660 Silver)
    Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM6375 Snapdragon 695 5G (6 nm)
    GPU Adreno 610 Adreno 619
    Memory 128GB, 4GB RAM 6GB RAM, 128GB ROM
    Card Slot No microSDXC
    Battery Li-Po 7250 mAh, non-removable battery Li-Po 8340 mAh, non-removable battery
    Fast charging 33W
    Reverse charging
    USB Power Delivery
    OS Android 13, MagicOS 7.1 Android, Realme UI 3.0
    Skrin
    Display Type TFT LCD, 120Hz IPS LCD, 450 nits (peak)
    Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
    1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
    10.95 inches, 341.3 cm2 (~82.6% screen-to-body ratio)
    1200 x 2000 pixels, 5:3 ratio (~213 ppi density)
    Badan
    Body Dimension 267.3 x 167.4 x 6.9 mm
    Body Weight 495g 499g
    Body Type Glass front, aluminum frame, aluminum back Glass front, plastic frame, plastic back
    Stylus support (magnetic charging)
    Colors Space Gray Glowing Gray, Glacier Blue
    Kamera
    Rear Camera 5 MP, f/2.2, AF 13 MP, f/2.2, (wide)
    Front Camera 5 MP, f/2.2 8 MP, f/2.0, 105˚ (ultrawide)
    Video 1080p@30fps
    Selfie: 1080p@30fps
    1080p@30fps
    Selfie: 1080p@30fps
    Camera Features HDR Panorama
    Komunikasi
    Sim Card No Dual SIM (Nano-SIM, dual stand-by)
    Data Speed HSPA 42.2/5.76 Mbps, LTE
    WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 b/g/n/ac, hotspot
    Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
    NFC No No
    USB USB Type-C, OTG USB Type-C 2.0, USB On-The-Go
    Sensor
    Sensor Accelerometer Accelerometer
    GPS No
    Audio
    Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
    3.5mm Jack No No
    24-bit/192kHz audio

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