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    Perbandingan Honor Pad X9 dan Redmi Pad

    Price: Dari RM1069   1499 Dari RM499   899
    Dilancarkan
    Release Status Release 2023, Jul 20 Release 2022, Oct 05
    Prestasi
    CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
    Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) MediaTek Helio G99 (6nm)
    GPU Adreno 610 Mali-G57 MC2
    Memory 256GB, 8GB RAM 3GB RAM, 64GB ROM
    Card Slot No microSDXC
    Battery Li-Po 7250 mAh, non-removable battery Li-Po 8000 mAh, non-removable battery
    Fast charging 18W
    OS Android 13, MagicOS 7.1 Android 12, MIUI 13
    Skrin
    Display Type TFT LCD, 120Hz IPS LCD, 1B colors, 90Hz, 400 nits (typ)
    Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
    1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
    10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
    1200 x 2000 pixels, 5:3 ratio (~220 ppi density)
    Badan
    Body Dimension 267.3 x 167.4 x 6.9 mm 250.5 x 158.1 x 7.1 mm
    Body Weight 495g 465g
    Body Type Glass front, aluminum frame, aluminum back Metal frame
    Colors Space Gray Graphite Gray, Moonlight Silver, Mint Green
    Kamera
    Rear Camera 5 MP, f/2.2, AF 8 MP, AF
    Front Camera 5 MP, f/2.2 8 MP, 105°
    Video 1080p@30fps
    Selfie: 1080p@30fps
    1080p@30fps
    Selfie: 1080p@30fps
    Camera Features HDR
    Komunikasi
    Sim Card No No
    WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
    Bluetooth 5.1, A2DP, LE 5.3, A2DP, LE
    NFC No No
    USB USB Type-C, OTG USB Type-C
    Sensor
    Sensor Accelerometer Yes
    GPS Unspecified
    Audio
    Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
    3.5mm Jack No No

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