Perbandingan Honor Pad X9 dan Xiaomi Pad SE

    Price: Dari RM779   1099
    Release Status Release 2023, Jul 20 Rumored
    CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
    Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
    GPU Adreno 610 Adreno 610
    Memory 128GB, 4GB RAM 128GB 4GB RAM
    Card Slot No microSDXC
    Battery Li-Po 7250 mAh, non-removable battery Li-Po 8000 mAh, non-removable battery
    10W wired
    OS Android 13, MagicOS 7.1 Android 13, MIUI 14
    Display Type TFT LCD, 120Hz IPS LCD, 90Hz, 400 nits (typ)
    Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
    1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
    11.0 inches, 350.9 cm2 (~82.2% screen-to-body ratio)
    1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
    Body Dimension 267.3 x 167.4 x 6.9 mm 255.5 x 167.1 x 7.4 mm
    Body Weight 495g 478g
    Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum back, aluminum frame
    Colors Space Gray Gray, MInt, Purple
    Rear Camera 5 MP, f/2.2, AF 8 MP, f/2.0, (wide), AF
    Front Camera 5 MP, f/2.2 5 MP, f/2.2, (ultrawide)
    Video 1080p@30fps
    Selfie: 1080p@30fps
    Selfie: 1080p@30fps
    Camera Features HDR
    Sim Card No No
    WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
    Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
    NFC No No
    USB USB Type-C, OTG USB Type-C, OTG
    Sensor Accelerometer Accelerometer, proximity (accessories only)
    Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers
    3.5mm Jack No Yes

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