Dari RM1499 Banding
Honor Pad 9 dikuasakan oleh pemproses CPU Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) dengan storan 256GB, 8GB RAM. Peranti ini juga mempunyai skrin 12.1-inci IPS LCD. Ia mempunyai kamera belakang 13 MP, f/2.0, (wide), AFMP dan menyokong Wifi dan Bluetoth. Ia juga dilengkapi dengan 8300 mAh dengan ketebalan peranti 7 mm, seberat 559g, dan menggunakan Android 13, Magic OS 7.2.
Harga Honor Pad 9 di Malaysia bermula pada RM1499.
Spesifikasi Honor Pad 9 | |
---|---|
Dilancarkan | |
Release Status | Release 2024, Mar 20 |
Prestasi | |
CPU | Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) |
Chipset | Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) |
GPU | Adreno 710 |
Memory | 256GB, 8GB RAM |
Card Slot | No |
Battery | 8300 mAh, non-removable battery 35W wired |
OS | Android 13, Magic OS 7.2 |
Skrin | |
Display Type | IPS LCD, 1B colors, 120Hz, 500 nits (typ) |
Display Size | 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio) 1600 x 2560 pixels, 16:10 ratio (~249 ppi density) |
Display Features | Anti-glare glass |
Badan | |
Body Dimension | 278.2 x 180.1 x 7 mm |
Body Weight | 559g |
Body Type | Glass front, aluminum frame, aluminum back Stylus support |
Colors | Space Gray, Cyan Lake |
Kamera | |
Rear Camera | 13 MP, f/2.0, (wide), AF |
Front Camera | 8 MP, f/2.2, (wide) |
Video | 4K@30fps, 1080p@30fps Selfie: 1080p@30fps |
Camera Features | LED flash |
Komunikasi | |
Sim Card | No |
WLAN | Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct |
Bluetooth | 5.1, A2DP, LE |
NFC | No |
USB | USB Type-C 2.0, OTG |
Sensor | |
Sensor | Accelerometer |
GPS | No |
Audio | |
Loud Speaker | Yes, with stereo speakers (8 speakers) |
3.5mm Jack | No |
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