Dari RM499 Banding
Honor Pad X7 dikuasakan oleh pemproses CPU Qualcomm SM6225 Snapdragon 680 (6 nm) dengan storan 128GB 4GB RAM. Peranti ini juga mempunyai skrin 8.7-inci IPS LCD. Ia mempunyai kamera belakang 8 MP, f/2.0, AFMP dan menyokong Wifi dan Bluetoth. Ia juga dilengkapi dengan Li-Ion 7020 mAh dengan ketebalan peranti 8 mm, seberat 365g, dan menggunakan Android 15, MagicOS 9.
Harga Honor Pad X7 di Malaysia bermula pada RM499.
Spesifikasi Honor Pad X7 | |
|---|---|
Dilancarkan | |
| Release Status | Release 2025, Sep 26 |
Prestasi | |
| CPU | Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) |
| Chipset | Qualcomm SM6225 Snapdragon 680 (6 nm) |
| GPU | Adreno 610 |
| Memory | 128GB 4GB RAM |
| Card Slot | microSDXC |
| Battery | Li-Ion 7020 mAh battery 10W wired |
| OS | Android 15, MagicOS 9 |
Skrin | |
| Display Type | IPS LCD, 90Hz, 500 nits (typ), 625 nits (HBM) |
| Display Size | 8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio) 800 x 1340 pixels, 5:3 ratio (~179 ppi density) |
Badan | |
| Body Dimension | 211.8 x 124.8 x 8 mm |
| Body Weight | 365g |
| Body Type | Glass front, aluminum frame, aluminum back |
| Colors | Gray |
Kamera | |
| Rear Camera | 8 MP, f/2.0, AF |
| Front Camera | 5 MP, f/2.2 |
| Video | 1080p@30fps Selfie: 1080p@30fps |
| Camera Features | HDR |
Komunikasi | |
| Sim Card | No |
| WLAN | Wi-Fi 802.11 a/b/g/n/ac, dual-band |
| Bluetooth | 5.0, A2DP, LE |
| NFC | No |
| USB | USB Type-C, OTG |
Sensor | |
| Sensor | Accelerometer Circle to Search |
| GPS | No |
Audio | |
| Loud Speaker | Yes, with stereo speakers |
| 3.5mm Jack | No 24-bit/192kHz Hi-Res & Hi-Res Wireless audio |
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