Dari RM399 Banding
TECNO SPARK Go 2024 dikuasakan oleh pemproses CPU Unisoc T606 (12 nm) dengan storan 4GB RAM, 128GB ROM. Peranti ini juga mempunyai skrin 6.6-inci IPS LCD. Ia mempunyai kamera belakang 13 MP, f/1.9, (wide), 1.12µm, AF
0.08 MP (auxiliary lens)MP dan menyokong Wifi, Bluetoth, GPS, HSPA dan LTE. Ia juga dilengkapi dengan Li-Po 5000 mAh dengan ketebalan peranti 8.6 mm, dan menggunakan Android 13 (Go edition), HIOS 13.
Harga TECNO SPARK Go 2024 di Malaysia bermula pada RM399.
Spesifikasi TECNO SPARK Go 2024 | |
---|---|
Dilancarkan | |
Release Status | Release 2023, Dec 01 |
Prestasi | |
CPU | Octa-core (2x1.6 GHz Cortex-A75 & 6x1.6 GHz Cortex-A55) |
Chipset | Unisoc T606 (12 nm) |
GPU | Mali-G57 MP1 |
Memory | 4GB RAM, 128GB ROM |
Card Slot | microSDXC |
Battery | Li-Po 5000 mAh, non-removable battery 10W wired |
OS | Android 13 (Go edition), HIOS 13 |
Skrin | |
Display Type | IPS LCD, 90Hz |
Display Size | 6.6 inches, 104.6 cm2 (~84.6% screen-to-body ratio) 720 x 1612 pixels, 20:9 ratio (~267 ppi density) |
Badan | |
Body Dimension | 163.7 x 75.6 x 8.6 mm |
Body Type | Glass front, plastic back, plastic frame |
Colors | Mecha Black, Amber Gold, Hurricane Blue |
Kamera | |
Rear Camera | 13 MP, f/1.9, (wide), 1.12µm, AF 0.08 MP (auxiliary lens) |
Front Camera | 8 MP |
Video | 1080p@30fps Selfie: Yes |
Camera Features | Dual-LED flash, HDR Selfie: Dual-LED flash |
Komunikasi | |
Sim Card | Dual SIM (Nano-SIM, dual stand-by) |
Data Speed | HSPA, LTE |
WLAN | Yes |
Bluetooth | Yes |
NFC | No |
USB | USB Type-C, OTG |
Sensor | |
Sensor | Fingerprint (side-mounted), accelerometer |
GPS | GPS |
Audio | |
Loud Speaker | Yes, with dual speakers |
3.5mm Jack | Yes |
Komen: