Spesifikasi dan harga Honor Pad X9 di Malaysia
- Updated: May 10, 2025
Dari RM1499 Banding
Varian:
Honor Pad X9 dikuasakan oleh pemproses CPU Qualcomm SM6225 Snapdragon 685 (6 nm) dengan storan 256GB, 8GB RAM. Peranti ini juga mempunyai skrin 11.5-inci TFT LCD. Ia mempunyai kamera belakang 5 MP, f/2.2, AFMP dan menyokong Wifi dan Bluetoth. Ia juga dilengkapi dengan Li-Po 7250 mAh dengan ketebalan peranti 6.9 mm, seberat 495g, dan menggunakan Android 13, MagicOS 7.1.
Harga Honor Pad X9 di Malaysia bermula pada RM1499.
Spesifikasi Honor Pad X9 | |
|---|---|
Dilancarkan | |
| Release Status | Release 2023, Jul 20 |
Prestasi | |
| CPU | Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) |
| Chipset | Qualcomm SM6225 Snapdragon 685 (6 nm) |
| GPU | Adreno 610 |
| Memory | 256GB, 8GB RAM |
| Card Slot | No |
| Battery | Li-Po 7250 mAh, non-removable battery |
| OS | Android 13, MagicOS 7.1 |
Skrin | |
| Display Type | TFT LCD, 120Hz |
| Display Size | 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio) 1200 x 2000 pixels, 5:3 ratio (~203 ppi density) |
Badan | |
| Body Dimension | 267.3 x 167.4 x 6.9 mm |
| Body Weight | 495g |
| Body Type | Glass front, aluminum frame, aluminum back |
| Colors | Space Gray |
Kamera | |
| Rear Camera | 5 MP, f/2.2, AF |
| Front Camera | 5 MP, f/2.2 |
| Video | 1080p@30fps Selfie: 1080p@30fps |
| Camera Features | HDR |
Komunikasi | |
| Sim Card | No |
| WLAN | Wi-Fi 802.11 a/b/g/n/ac, dual-band |
| Bluetooth | 5.1, A2DP, LE |
| NFC | No |
| USB | USB Type-C, OTG |
Sensor | |
| Sensor | Accelerometer |
Audio | |
| Loud Speaker | Yes, with stereo speakers (6 speakers) |
| 3.5mm Jack | No |
*Ciri dan spesifikasi boleh berubah tanpa pemberitahuan.
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