More

    Spesifikasi dan harga Honor X6b di Malaysia

    Honor X6b dikuasakan oleh pemproses CPU Mediatek Helio G85 (12 nm) dengan storan 6GB RAM, 128GB ROM. Peranti ini juga mempunyai skrin 6.56-inci TFT LCD. Ia mempunyai kamera belakang Dual: 50 MP, f/1.8, (wide), PDAF + 2 MP, f/2.4, (depth)MP dan menyokong Wifi, Bluetoth, GPS, HSPA dan LTE. Ia juga dilengkapi dengan Li-Po 5200 mAh dengan ketebalan peranti 8.4 mm, seberat 192g, dan menggunakan Android 14, Magic OS 8.

    Spesifikasi Honor X6b

    Dilancarkan
    Release Status Coming soon. Exp. release 2024, June
    Prestasi
    CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
    Chipset Mediatek Helio G85 (12 nm)
    GPU Mali-G52 MC2
    Memory 6GB RAM, 128GB ROM
    Card Slot microSDXC
    Battery Li-Po 5200 mAh, non-removable battery
    35W wired, 31% in 20 min (advertised)
    OS Android 14, Magic OS 8
    Skrin
    Display Type TFT LCD, 90Hz, 780 nits (peak)
    Display Size 6.56 inches, 103.4 cm2 (~83.9% screen-to-body ratio)
    720 x 1612 pixels, 20:9 ratio (~269 ppi density)
    Display Features Always-on display
    Badan
    Body Dimension 163.6 x 75.3 x 8.4 mm
    Body Weight 192g
    Colors Sky Silver,Midnight Black
    Kamera
    Rear Camera Dual: 50 MP, f/1.8, (wide), PDAF + 2 MP, f/2.4, (depth)
    Front Camera 5 MP, f/2.2, (wide)
    Video 1080p@30fps
    Selfie: 1080p@30fps
    Camera Features LED flash, HDR, panorama
    Komunikasi
    Sim Card Dual SIM (Nano-SIM, dual stand-by)
    Data Speed HSPA, LTE
    WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
    Bluetooth 5.1, A2DP, LE, aptX HD
    NFC No
    USB USB Type-C 2.0, OTG
    Sensor
    Sensor Fingerprint (side-mounted), accelerometer, gyro, proximity, compass
    GPS GPS, GLONASS, GALILEO, BDS
    Audio
    Loud Speaker Yes
    3.5mm Jack 3.5mm
    *Ciri dan spesifikasi boleh berubah tanpa pemberitahuan.

    Komen: