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    Perbandingan Redmi Pad SE dan Honor Pad X9

    Price: Dari RM659   799 Dari RM679   1099
    Dilancarkan
    Release Status Release 2023, Sep 27 Release 2023, Jul 20
    Prestasi
    CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
    Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
    GPU Adreno 610 Adreno 610
    Memory 8GB RAM, 256GB ROM 128GB, 4GB RAM
    Card Slot microSDXC No
    Battery Li-Po 8000 mAh, non-removable battery
    10W wired
    Li-Po 7250 mAh, non-removable battery
    OS Android 13, MIUI Pad 14 Android 13, MagicOS 7.1
    Skrin
    Display Type IPS LCD, 90Hz, 400 nits (typ) TFT LCD, 120Hz
    Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
    1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
    11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
    1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
    Badan
    Body Dimension 255.5 x 167.1 x 7.4 mm 267.3 x 167.4 x 6.9 mm
    Body Weight 478g 495g
    Body Type Glass front, aluminum back, aluminum frame Glass front, aluminum frame, aluminum back
    Colors Lavender Purple, Graphite Gray, Mint Green Space Gray
    Kamera
    Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 5 MP, f/2.2, AF
    Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 5 MP, f/2.2
    Video 1080p@30fps
    Selfie: 1080p@30fps
    1080p@30fps
    Selfie: 1080p@30fps
    Camera Features HDR
    Komunikasi
    Sim Card No No
    WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
    Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
    NFC No No
    USB USB Type-C, OTG USB Type-C, OTG
    Sensor
    Sensor Accelerometer, proximity (accessories only) Accelerometer
    GPS No
    Audio
    Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (6 speakers)
    3.5mm Jack Yes
    24-bit/192kHz audio
    No

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